Abstract
This paper presents a method to simulate the effects of conductor surface roughness on conductor-backed coplanar waveguide (CB-CPW) interconnects using 3-D full wave simulation tools. In this paper, a high-frequency structure simulator (HFSS) from ANSYS has been implemented for rough surfaces with Gaussian correlation functions. The rough surfaces that exist between the dielectric and copper foils are modeled using a statistical random process approach. The varying heights for the random rough surface with specified autocorrelation function (ACF), root mean square height (Hrms), and correlation length (λ) are generated using Matlab, and these data are used in HFSS to model and simulate the performance of the CB-CPW interconnect with rough conductor surfaces. The results show that both Hrms and λ influence the overall attenuation coefficient, and the trends are consistent with the other studies in this area. The method presented in this paper provides designers with a technique to characterize the effect of conductor surface roughness for different types of transmission lines with varying substrates and extent of conductor roughness.
| Original language | English (US) |
|---|---|
| Article number | 6508843 |
| Pages (from-to) | 1038-1046 |
| Number of pages | 9 |
| Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Volume | 3 |
| Issue number | 6 |
| DOIs | |
| State | Published - 2013 |
Keywords
- Autocorrelation function (ACF)
- conductor loss
- conductor-backed coplanar waveguide (CB-CPW)
- interconnect
- power spectral density (PSD)
- root mean square height (H)
- surface roughness
- transmission lines
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering