TY - GEN
T1 - Boundary conditions and integrated sensors in microchannel convective heat transfer
AU - Lee, Man
AU - Cheung, Luthur Siu Lun
AU - Lee, Yi Kuen
AU - Zohar, Yitshak
PY - 2006
Y1 - 2006
N2 - A microchannel heat sink, integrated with pressure and temperature microsensors, is fabricated to study convective boiling under uniform heat flux boundary condition. Utilizing a wafer bond and etch back technology, the heat source, temperature and pressure sensors are separated from the fluid flow by a membrane only 1.5μm in thickness; thus, allowing good control of the thermal boundary conditions. Temperature and pressure distributions for various power levels and flow rates are measured while, simultaneously, the flow patterns are recorded. Single-phase flow results, compared with numerical simulations, confirm that the heat flux boundary condition is indeed nearly uniform. The sensor arrays, particularly for two-phase flow, provide the spatial and temporal dependence of both the temperature and pressures fields.
AB - A microchannel heat sink, integrated with pressure and temperature microsensors, is fabricated to study convective boiling under uniform heat flux boundary condition. Utilizing a wafer bond and etch back technology, the heat source, temperature and pressure sensors are separated from the fluid flow by a membrane only 1.5μm in thickness; thus, allowing good control of the thermal boundary conditions. Temperature and pressure distributions for various power levels and flow rates are measured while, simultaneously, the flow patterns are recorded. Single-phase flow results, compared with numerical simulations, confirm that the heat flux boundary condition is indeed nearly uniform. The sensor arrays, particularly for two-phase flow, provide the spatial and temporal dependence of both the temperature and pressures fields.
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U2 - 10.1115/icnmm2006-96117
DO - 10.1115/icnmm2006-96117
M3 - Conference contribution
AN - SCOPUS:33847002727
SN - 0791847608
SN - 9780791847602
T3 - Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006
SP - 1365
EP - 1371
BT - Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006
PB - American Society of Mechanical Engineers
T2 - 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006
Y2 - 19 June 2006 through 21 June 2006
ER -