Copper Chemical Mechanical Planarization (Cu-CMP) is a critical step in integrated circuit (IC) device manufacturing. CMP and post-CMP cleaning processes are projected to account for 30-40% of the water consumed by IC manufacturers in 2003. CMP wastewater is expected to contain increasing amounts of copper as the industry switches from Al-CMP to Cu-CMP causing some IC manufacturers to run the risk of violating discharge regulations. There are a variety of treatment schemes currently available for the removal of heavy metals from CMP wastewater, however, many introduce additional chemicals to the wastewater, have large space requirements, or are expensive. This work explores the use of microorganisms for waste treatment. A Staphylococcus sp. of bacteria was isolated and studied to determine the feasibility for use in removing copper from Cu-CMP wastewater. A model Cu-CMP wastewater was developed and tested, as well as actual Cu-CMP wastes. Continuous-flow packed column experiments were performed to obtain adsorption data and show copper recovery from the waste. A predictive, empirical model was used to accurately describe Cu removal. Additionally, the immobilized cells were regenerated, allowing for the concentration and potential recovery of copper from the wastewater.
- Mechanical planarization
ASJC Scopus subject areas
- Environmental Engineering
- Waste Management and Disposal
- Management, Monitoring, Policy and Law