Biaxial compression of a thin layer with circular debonding over a substrate

E. Madenci, H. Balkan, M. Quan

Research output: Contribution to journalArticlepeer-review

4 Scopus citations


This paper presents an analytical solution to the problem of a circular debonded thin film on a substrate subjected to biaxial compressive residual stresses. Contaminated regions may be the source of debonding during fabrication, and compressive stresses are induced in the film during the cooling stage of the fabrication process. The presence of such defects may influence the thermal/mechanical integrity of, for example, microelectronic devices. The stress intensity factors for this problem are obtained by solving a system of singular integral equations.

Original languageEnglish (US)
Pages (from-to)3465-3477
Number of pages13
JournalInternational Journal of Solids and Structures
Issue number23
StatePublished - Dec 1995

ASJC Scopus subject areas

  • Modeling and Simulation
  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Applied Mathematics


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