Biaxial compression of a thin layer with circular debonding over a substrate

This paper presents an analytical solution to the problem of a circular debonded thin film on a substrate subjected to biaxial compressive residual stresses. Contaminated regions may be the source of debonding during fabrication, and compressive stresses are induced in the film during the cooling stage of the fabrication process. The presence of such defects may influence the thermal/mechanical integrity of, for example, microelectronic devices. The stress intensity factors for this problem are obtained by solving a system of singular integral equations.