Application of the short-pulse propagation technique for broadband characterization of PCB and other interconnect technologies

Alina Deutsch, Roger S. Krabbenhoft, Kathleen L. Melde, Christopher W. Surovic, George A. Katopis, Gerard V. Kopcsay, Zhen Zhou, Zhaoqing Chen, Young H. Kwark, Thomas Michael Winkel, Xiaoxiong Gu, Theodorus E. Standaert

Research output: Contribution to journalArticlepeer-review

18 Scopus citations


A comprehensive overview is given of the strengths, limitations, and applicability of the short-pulse propagation technique (SPP). SPP is shown to be able to extract the broadband characteristics of a wide range of interconnect technologies found in digital computer applications and generate causal predictive models. Examples are given of such applications from on-chip wiring, ceramic and organic chip carrier, cards, boards, to cables, and structures with large inhomogeneities, such as found in differential and microstrip cases, irregularities (such as introduced by roughening of metallization), and various operating conditions, such as variable temperature and humidity. The use of SPP as a virtual test bench is explained and showcased through the analysis of the impact of manufacturing tolerances and via stub length on the electrical characteristics. The diverse versatility of the SPP method is discussed through many examples on practical interconnect structures with special emphasis on printed circuit board wiring.

Original languageEnglish (US)
Article number5404238
Pages (from-to)266-287
Number of pages22
JournalIEEE Transactions on Electromagnetic Compatibility
Issue number2
StatePublished - May 2010


  • Dielectric permittivity
  • Measurement techniques
  • Printed circuit board (PCB) wiring
  • Signal integrity
  • Transmission-line characterization

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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