TY - JOUR
T1 - Application of subspace projection approaches for reduced-order modeling of electromagnetic systems
AU - Zhou, Tingdong
AU - Dvorak, Steven L.
AU - Prince, John L.
N1 - Funding Information:
Manuscript received February 1, 2003; revised September 5, 2003. This paper was presented in part at the IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging. This work was supported in part by the Semiconductor Research Corporation (SRC) under contract 98-PP-086.
PY - 2003/11
Y1 - 2003/11
N2 - Subspace projection approaches, including the Fade via Lanczos (PVL), Krylov, and rational Krylov algorithms, are used for reduced-order modeling of wide-band electromagnetic systems. The properties of these algorithms are discussed. A frequency segmentation technique has also been used with the Lanczos algorithm to obtain benchmark data of electromagnetic fields and for scattering parameter extraction from the calculated electromagnetic field values. From the various techniques, the combined PVL/frequency segmentation technique is the most promising for efficient and accurate modeling of electromagnetic systems.
AB - Subspace projection approaches, including the Fade via Lanczos (PVL), Krylov, and rational Krylov algorithms, are used for reduced-order modeling of wide-band electromagnetic systems. The properties of these algorithms are discussed. A frequency segmentation technique has also been used with the Lanczos algorithm to obtain benchmark data of electromagnetic fields and for scattering parameter extraction from the calculated electromagnetic field values. From the various techniques, the combined PVL/frequency segmentation technique is the most promising for efficient and accurate modeling of electromagnetic systems.
KW - Frequency segmentation technique
KW - Krylov algorithm
KW - Padé Via Lanczos (PVL) algorithm
KW - Rational Krylov algorithm
KW - Reduced-order modeling
KW - Scattering parameter
KW - Subspace projection approaches
KW - Wide-band electromagnetic system
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U2 - 10.1109/TADVP.2003.821072
DO - 10.1109/TADVP.2003.821072
M3 - Article
AN - SCOPUS:0742286403
SN - 1521-3323
VL - 26
SP - 353
EP - 360
JO - IEEE Transactions on Advanced Packaging
JF - IEEE Transactions on Advanced Packaging
IS - 4
ER -