@inproceedings{208d04d4542c4f46ad101213d729c3b9,
title = "Application of slurry injection system (SIS) to advanced deep-trench (DT) CMP",
abstract = "A slurry injection system (SIS) from Araca Inc. is installed on a single-platen, single-carrier, 300 mm polisher and evaluated for 14 nm deep-trench (DT) CMP process. A 40 % reduction in slurry flow rate with equivalent removal rates and improved within-wafer oxide uniformity are demonstrated. A 400-wafer marathon run with SIS at 40 % reduced slurry flow rate shows stable rates without degradation in within-wafer uniformity and defectivity.",
keywords = "Chemical-mechanical Planarization, Cost reduction, Deep-trench isolation, Slurry Injection System, Slurry application",
author = "Amarnath Jha and Derek Stoll and Tseng, {Wei Tsu} and Changhong Wu and Yang, {Ji Chul} and Ara Philipossian",
note = "Publisher Copyright: {\textcopyright} VDE VERLAG GMBH Berlin Offenbach; 2017 International Conference on Planarization/CMP Technology, ICPT 2017 ; Conference date: 11-10-2017 Through 13-10-2017",
year = "2017",
language = "English (US)",
series = "ICPT 2017 - International Conference on Planarization/CMP Technology",
publisher = "VDE Verlag GmbH",
pages = "136--141",
booktitle = "ICPT 2017 - International Conference on Planarization/CMP Technology",
address = "Germany",
}