@inproceedings{eff8eb7077e24003867cadeeac0d2ede,
title = "Anodic dissolution of copper in hydroxylamine based solutions with special reference to electrochemical mechanical planarization (ECMP)",
abstract = "Hydroxylamine, a weak inorganic amine, etches copper and is considered for use in the planarization (removal of topography) of copper films during the manufacturing of integrated circuits. This paper reports and discusses results obtained from a study on the dissolution behaviour of copper in hydroxylamine solutions at different applied anodic potential values using Quartz Crystal Microbalance (QCM) technique. The dissolution rate of copper in hydroxylamine solution is pH dependant and exhibits a maximum in the vicinity of pH 6. Copper dissolution increases with applied overpotential (η) and dissolution rates as high as 6000 {\aa} min- 1 can be obtained at overpotential of 750mV. While both benzotriazole (BTA) and salicylhydroxamic acid (SHA) serve as good inhibitors at lower overpotentials, their effectiveness decreases at higher overpotentials.",
keywords = "Benzotriazole, Copper ECMP, Hydroxylamine, QCM, Salicylhydroxamic acid",
author = "A. Muthukumaran and N. Venkataraman and S. Tamilmani and S. Raghavan",
year = "2007",
language = "English (US)",
isbn = "9781622762439",
series = "47th Annual Conference of the Australasian Corrosion Association 2007: Corrosion Control 2007",
pages = "49--56",
booktitle = "47th Annual Conference of the Australasian Corrosion Association 2007",
note = "47th Annual Conference of the Australasian Corrosion Association 2007: Corrosion Control 2007 ; Conference date: 04-12-2007 Through 05-12-2007",
}