Abstract
The reliability of electronic packages is strongly influenced by the interfacial thermo-mechanical stresses arising from temperature excursions during fabrication and operation. Understanding the mechanisms for relaxing these interfacial thermo-mechanical stresses through the use of appropriate material selection is critical to the enhancement of their reliability. Therefore, this study provides analytical solutions for the asymptotic stress field ahead of the interface crack tip emanating from the apex of a wedge composed of dissimilar materials exhibiting elastic and/or elastic-plastic deformations.
Original language | English (US) |
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Pages (from-to) | 475-486 |
Number of pages | 12 |
Journal | Engineering Fracture Mechanics |
Volume | 68 |
Issue number | 4 |
DOIs | |
State | Published - Mar 1 2001 |
ASJC Scopus subject areas
- General Materials Science
- Mechanics of Materials
- Mechanical Engineering