Analysis method for bonded patch repair of a skin with a cutout

A. Barut, J. Hanauska, E. Madenci, D. R. Ambur

Research output: Contribution to journalArticlepeer-review

26 Scopus citations

Abstract

This study presents an analysis method for determining the transverse shear and normal stresses in the adhesive and in-plane stresses in the repair patch and in the repaired skin. The damage to the skin is represented in the form of a cutout. The circular or elliptical cutout can be located arbitrarily under the patch. The patch is free of external tractions while the skin is subjected to general loading along its external edge. The method utilizes the principle of minimum potential energy in conjunction with complex potential functions to analyze a patch-repaired damage configuration. The present results have been validated against experimental measurements and three-dimensional finite element (FE) predictions concerning the patch repair of a circular cutout in a skin under uniform loading.

Original languageEnglish (US)
Pages (from-to)277-294
Number of pages18
JournalComposite Structures
Volume55
Issue number3
DOIs
StatePublished - Feb 2002

Keywords

  • Adhesive
  • Composite
  • Cutout
  • Patch
  • Repair

ASJC Scopus subject areas

  • Ceramics and Composites
  • Civil and Structural Engineering

Fingerprint

Dive into the research topics of 'Analysis method for bonded patch repair of a skin with a cutout'. Together they form a unique fingerprint.

Cite this