Alignment process for fabrication of mirror-based optical via using maskless lithography tool with buffer coat materials

Sunglin Wang; Chris Summitt; Tao Ge; Lee Johnson; Melissa Zaverton; Tom Milster; Yuzuru Takashima

Alignment process for fabrication of mirror-based optical via using maskless lithography tool with buffer coat materials

Sunglin Wang, Chris Summitt, Tao Ge, Lee Johnson, Melissa Zaverton, Tom Milster, Yuzuru Takashima

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English (US)
Title of host publication	International Conference and Exhibition on Device Packaging 2014
Publisher	International Microelectronics and Packaging Society, Nordic
Pages	280-284
Number of pages	5
ISBN (Print)	9781632665812
State	Published - 2014
Event	IMAPS International Conference and Exhibition on Device Packaging 2014, in Conjunction with the Global Business Council, GBC Spring Conference - Scottsdale/Fountain Hills, AZ, United States Duration: Mar 10 2014 → Mar 13 2014

Publication series

Name	International Conference and Exhibition on Device Packaging 2014

Other

Other	IMAPS International Conference and Exhibition on Device Packaging 2014, in Conjunction with the Global Business Council, GBC Spring Conference
Country/Territory	United States
City	Scottsdale/Fountain Hills, AZ
Period	3/10/14 → 3/13/14

Keywords

CMOS compatible fabrication
Micro optics
Optical Coupler
Optical via
Silicon photonics
Three dimensional optical circuit

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials

Cite this

Wang, S., Summitt, C., Ge, T., Johnson, L., Zaverton, M., Milster, T., & Takashima, Y. (2014). Alignment process for fabrication of mirror-based optical via using maskless lithography tool with buffer coat materials. In International Conference and Exhibition on Device Packaging 2014 (pp. 280-284). (International Conference and Exhibition on Device Packaging 2014). International Microelectronics and Packaging Society, Nordic.

Alignment process for fabrication of mirror-based optical via using maskless lithography tool with buffer coat materials. / Wang, Sunglin; Summitt, Chris; Ge, Tao et al.
International Conference and Exhibition on Device Packaging 2014. International Microelectronics and Packaging Society, Nordic, 2014. p. 280-284 (International Conference and Exhibition on Device Packaging 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Wang, S, Summitt, C, Ge, T, Johnson, L, Zaverton, M, Milster, T & Takashima, Y 2014, Alignment process for fabrication of mirror-based optical via using maskless lithography tool with buffer coat materials. in International Conference and Exhibition on Device Packaging 2014. International Conference and Exhibition on Device Packaging 2014, International Microelectronics and Packaging Society, Nordic, pp. 280-284, IMAPS International Conference and Exhibition on Device Packaging 2014, in Conjunction with the Global Business Council, GBC Spring Conference, Scottsdale/Fountain Hills, AZ, United States, 3/10/14.

Wang S, Summitt C, Ge T, Johnson L, Zaverton M, Milster T et al. Alignment process for fabrication of mirror-based optical via using maskless lithography tool with buffer coat materials. In International Conference and Exhibition on Device Packaging 2014. International Microelectronics and Packaging Society, Nordic. 2014. p. 280-284. (International Conference and Exhibition on Device Packaging 2014).

Wang, Sunglin ; Summitt, Chris ; Ge, Tao et al. / Alignment process for fabrication of mirror-based optical via using maskless lithography tool with buffer coat materials. International Conference and Exhibition on Device Packaging 2014. International Microelectronics and Packaging Society, Nordic, 2014. pp. 280-284 (International Conference and Exhibition on Device Packaging 2014).

@inproceedings{769c606fdee44b6b9770661e4b46c6a2,

title = "Alignment process for fabrication of mirror-based optical via using maskless lithography tool with buffer coat materials",

keywords = "CMOS compatible fabrication, Micro optics, Optical Coupler, Optical via, Silicon photonics, Three dimensional optical circuit",

author = "Sunglin Wang and Chris Summitt and Tao Ge and Lee Johnson and Melissa Zaverton and Tom Milster and Yuzuru Takashima",

year = "2014",

language = "English (US)",

isbn = "9781632665812",

series = "International Conference and Exhibition on Device Packaging 2014",

publisher = "International Microelectronics and Packaging Society, Nordic",

pages = "280--284",

booktitle = "International Conference and Exhibition on Device Packaging 2014",

note = "IMAPS International Conference and Exhibition on Device Packaging 2014, in Conjunction with the Global Business Council, GBC Spring Conference ; Conference date: 10-03-2014 Through 13-03-2014",

}

TY - GEN

T1 - Alignment process for fabrication of mirror-based optical via using maskless lithography tool with buffer coat materials

AU - Wang, Sunglin

AU - Summitt, Chris

AU - Ge, Tao

AU - Johnson, Lee

AU - Zaverton, Melissa

AU - Milster, Tom

AU - Takashima, Yuzuru

PY - 2014

Y1 - 2014

KW - CMOS compatible fabrication

KW - Micro optics

KW - Optical Coupler

KW - Optical via

KW - Silicon photonics

KW - Three dimensional optical circuit

UR - http://www.scopus.com/inward/record.url?scp=84907322483&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84907322483&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84907322483

SN - 9781632665812

T3 - International Conference and Exhibition on Device Packaging 2014

SP - 280

EP - 284

BT - International Conference and Exhibition on Device Packaging 2014

PB - International Microelectronics and Packaging Society, Nordic

T2 - IMAPS International Conference and Exhibition on Device Packaging 2014, in Conjunction with the Global Business Council, GBC Spring Conference

Y2 - 10 March 2014 through 13 March 2014

ER -

Alignment process for fabrication of mirror-based optical via using maskless lithography tool with buffer coat materials

Publication series

Other

Keywords

ASJC Scopus subject areas

Other files and links

Cite this