Adhesion phenomena pertaining to thermal interface materials and solder interconnects in microelectronic packaging: A critical review

Keyphrases

• Adhesion Quality 33%
• Assembly Interaction 33%
• Ball Grid Array 33%
• Chip Assembly 33%
• Communication Intelligence 33%
• Integrated Heat Spreader 100%
• Package Architecture 33%
• Package Quality 33%
• Package Reliability 33%
• Semiconductor Packaging 33%
• Solder Interconnect 100%
• Thermal Interface Materials 100%

Material Science

• Electronic Circuit 50%
• Interface (Material) 100%
• Material Selection 50%
• Metal Interface 50%

Engineering

• Ball Grid Arrays 50%