A new thermomechanical fracture analysis approach for 3D integration technology

Abigail Agwai; Ibrahim Guven; Erdogan Madenci

doi:10.1109/ECTC.2011.5898595

A new thermomechanical fracture analysis approach for 3D integration technology

Abigail Agwai
, Ibrahim Guven
, Erdogan Madenci

Aerospace and Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Scopus citations

Abstract

In this study, the peridynamic framework is applied to model heat diffusion to derive peridynamic heat diffusion equations. A numerical scheme is put forward and implemented in order to establish the validity of these equations. Finally, an approach is developed for coupled solution of heat conduction and solid mechanics equations in the realm of peridynamics.

Original language	English (US)
Title of host publication	2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
Pages	740-745
Number of pages	6
DOIs	https://doi.org/10.1109/ECTC.2011.5898595
State	Published - 2011
Event	2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL, United States Duration: May 31 2011 → Jun 3 2011

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Other

Other	2011 61st Electronic Components and Technology Conference, ECTC 2011
Country/Territory	United States
City	Lake Buena Vista, FL
Period	5/31/11 → 6/3/11

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/ECTC.2011.5898595

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A new thermomechanical fracture analysis approach for 3D integration technology. / Agwai, Abigail; Guven, Ibrahim; Madenci, Erdogan.
2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011. 2011. p. 740-745 5898595 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Agwai, A, Guven, I & Madenci, E 2011, A new thermomechanical fracture analysis approach for 3D integration technology. in 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011., 5898595, Proceedings - Electronic Components and Technology Conference, pp. 740-745, 2011 61st Electronic Components and Technology Conference, ECTC 2011, Lake Buena Vista, FL, United States, 5/31/11. https://doi.org/10.1109/ECTC.2011.5898595

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abstract = "In this study, the peridynamic framework is applied to model heat diffusion to derive peridynamic heat diffusion equations. A numerical scheme is put forward and implemented in order to establish the validity of these equations. Finally, an approach is developed for coupled solution of heat conduction and solid mechanics equations in the realm of peridynamics.",

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AU - Guven, Ibrahim

AU - Madenci, Erdogan

PY - 2011

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AB - In this study, the peridynamic framework is applied to model heat diffusion to derive peridynamic heat diffusion equations. A numerical scheme is put forward and implemented in order to establish the validity of these equations. Finally, an approach is developed for coupled solution of heat conduction and solid mechanics equations in the realm of peridynamics.

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U2 - 10.1109/ECTC.2011.5898595

DO - 10.1109/ECTC.2011.5898595

M3 - Conference contribution

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BT - 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011

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Y2 - 31 May 2011 through 3 June 2011

ER -

A new thermomechanical fracture analysis approach for 3D integration technology

Abstract

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Other

ASJC Scopus subject areas

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