A new multi-ramp driver model with RLC interconnect load

Lakshmi K. Vakati; Janet Wang

A new multi-ramp driver model with RLC interconnect load

Lakshmi K. Vakati, Janet Wang

Electrical and Computer Engineering

Research output: Contribution to journal › Conference article › peer-review

5 Scopus citations

Abstract

As the feature size is scaled down to 90 nm and below, fundamental modeling changes, such as the nonlinearity and higher frequencies of signals, require driver-load models to take into account propagation delay and slew rates. The conventional single Ceff (one-ramp) with lumped RC model is no longer accurate. In this paper we propose a new multi-ramp model with general RLC interconnects as loads. This new model accurately predicts both the 50% delay and the overall output waveform shape with inductance effects.

Original language	English (US)
Pages (from-to)	V-269-V-272
Journal	Proceedings - IEEE International Symposium on Circuits and Systems
Volume	5
State	Published - 2004
Event	2004 IEEE International Symposium on Circuits and Systems - Proceedings - Vancouver, BC, Canada Duration: May 23 2004 → May 26 2004

ASJC Scopus subject areas

Electrical and Electronic Engineering

Cite this

@article{2b856ccd3999497fb4053e873acd45fc,

title = "A new multi-ramp driver model with RLC interconnect load",

abstract = "As the feature size is scaled down to 90 nm and below, fundamental modeling changes, such as the nonlinearity and higher frequencies of signals, require driver-load models to take into account propagation delay and slew rates. The conventional single Ceff (one-ramp) with lumped RC model is no longer accurate. In this paper we propose a new multi-ramp model with general RLC interconnects as loads. This new model accurately predicts both the 50% delay and the overall output waveform shape with inductance effects.",

author = "Vakati, {Lakshmi K.} and Janet Wang",

year = "2004",

language = "English (US)",

volume = "5",

pages = "V--269--V--272",

journal = "Proceedings - IEEE International Symposium on Circuits and Systems",

issn = "0271-4310",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "2004 IEEE International Symposium on Circuits and Systems - Proceedings ; Conference date: 23-05-2004 Through 26-05-2004",

}

TY - JOUR

T1 - A new multi-ramp driver model with RLC interconnect load

AU - Vakati, Lakshmi K.

AU - Wang, Janet

PY - 2004

Y1 - 2004

N2 - As the feature size is scaled down to 90 nm and below, fundamental modeling changes, such as the nonlinearity and higher frequencies of signals, require driver-load models to take into account propagation delay and slew rates. The conventional single Ceff (one-ramp) with lumped RC model is no longer accurate. In this paper we propose a new multi-ramp model with general RLC interconnects as loads. This new model accurately predicts both the 50% delay and the overall output waveform shape with inductance effects.

AB - As the feature size is scaled down to 90 nm and below, fundamental modeling changes, such as the nonlinearity and higher frequencies of signals, require driver-load models to take into account propagation delay and slew rates. The conventional single Ceff (one-ramp) with lumped RC model is no longer accurate. In this paper we propose a new multi-ramp model with general RLC interconnects as loads. This new model accurately predicts both the 50% delay and the overall output waveform shape with inductance effects.

UR - http://www.scopus.com/inward/record.url?scp=4344679402&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=4344679402&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:4344679402

SN - 0271-4310

VL - 5

SP - V-269-V-272

JO - Proceedings - IEEE International Symposium on Circuits and Systems

JF - Proceedings - IEEE International Symposium on Circuits and Systems

T2 - 2004 IEEE International Symposium on Circuits and Systems - Proceedings

Y2 - 23 May 2004 through 26 May 2004

ER -

A new multi-ramp driver model with RLC interconnect load

Abstract

ASJC Scopus subject areas

Other files and links

Fingerprint

Cite this