A mini review on thermally conductive polymers and polymer-based composites

Yanfei Xu, Xiaojia Wang, Qing Hao

Research output: Contribution to journalShort surveypeer-review

66 Scopus citations


The continuous trend of miniaturization leads to unprecedented power densities within electronic devices, which also becomes the bottleneck of the device performance. Effective cooling of electronic devices is critical and polymer-based materials may play an important role in this important direction, with advantages such as low cost, corrosion resistance, light weight, and flexibility. For thermal management applications, the intrinsically low thermal conductivities of amorphous polymers can be dramatically enhanced with strain-induced crystallization and ultra-high-conductivity fillers. In this mini review, some advancements in this field are summarized and discussed, followed by a prospective on future directions.

Original languageEnglish (US)
Article number100617
JournalComposites Communications
StatePublished - Apr 2021


  • Filler
  • Polymer
  • Strain
  • Thermal conductivity

ASJC Scopus subject areas

  • Ceramics and Composites
  • Mechanics of Materials
  • Polymers and Plastics
  • Materials Chemistry


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