Abstract
A knowledge-based simulation environment is developed to facilitate the early design of Multichip Modules (MCMs). Electrical system performance measures such as module clock frequency, etc. are predicted and analyzed for different interconnect and packaging technologies. Performance-limiting factors such as power dissipation, coupled noise, and simultaneous switching noise are also included in this work. CMOS based MCMs for workstation applications are used to demonstrate the feasibility of the system in development.
Original language | English (US) |
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Pages (from-to) | xlvii-lix |
Journal | Microelectronics Journal |
Volume | 25 |
Issue number | 5 |
DOIs | |
State | Published - Aug 1994 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering