TY - JOUR
T1 - A high-Q reconfigurable planar EBG cavity resonator
AU - Hill, Michael J.
AU - Ziolkowski, Richard W.
AU - Papapolymerou, John
N1 - Funding Information:
Manuscript received January 22, 2001; revised April 23, 2001. This work was supported in part by the Air Force Office of Scientific Research, Air Force Material Command, USAF, under Grant F49620-96-1-0039 and by the NSF-S/IUCRC Center for Low Power Electronics (CLPE) under Grant EEC-9523338. The review of this letter was arranged by Associate Editor Dr. Ruediger Vahldieck.
PY - 2001/6
Y1 - 2001/6
N2 - A reconfigurable planar electromagnetic bandgap (EBG) cavity resonator has been designed, fabricated, and tested. The resonator, based on a microstrip-coupled cavity constructed with periodic metallic post side walls, resonates at 10.60 GHz or 8.63 GHz, depending on the state of two rows of switchable post elements. Fabricated on 0.031 inches 5880 Duroid, the resonator exhibits Qs of 448 and 274 for the 10.60-GHz and 8.63-GHz resonances, respectively. In addition to the reasonably high Qs achievable with this design, the circuit utilizes standard printed circuit board (PCB) fabrication techniques and is 100% compatible with commercial PCB processes, enabling low-cost mass production.
AB - A reconfigurable planar electromagnetic bandgap (EBG) cavity resonator has been designed, fabricated, and tested. The resonator, based on a microstrip-coupled cavity constructed with periodic metallic post side walls, resonates at 10.60 GHz or 8.63 GHz, depending on the state of two rows of switchable post elements. Fabricated on 0.031 inches 5880 Duroid, the resonator exhibits Qs of 448 and 274 for the 10.60-GHz and 8.63-GHz resonances, respectively. In addition to the reasonably high Qs achievable with this design, the circuit utilizes standard printed circuit board (PCB) fabrication techniques and is 100% compatible with commercial PCB processes, enabling low-cost mass production.
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U2 - 10.1109/7260.928930
DO - 10.1109/7260.928930
M3 - Letter
AN - SCOPUS:0035381927
SN - 1531-1309
VL - 11
SP - 255
EP - 257
JO - IEEE Microwave and Wireless Components Letters
JF - IEEE Microwave and Wireless Components Letters
IS - 6
ER -