TY - GEN
T1 - A fully parameterized finite element model of a grand piano soundboard for sensitivity analysis of the dynamic behavior
AU - Mokdad, Fatma
AU - Missoum, Samy
PY - 2013
Y1 - 2013
N2 - This work in progress aims at investigating the influence of several parameters on the modal behavior of a grand piano soundboard. The sensitivity analysis is made possible by the development of a fully parameterized Finite Element model of the soundboard which allows the user to modify most geometric and material parameters involved in its dynamic behavior. In addition, crowning and downbearing are included in the model. This study also considers the influence of geometric nonlinearities due to downbearing. The sensitivity analysis is performed using Spearman rank correlation and Sobol indices.
AB - This work in progress aims at investigating the influence of several parameters on the modal behavior of a grand piano soundboard. The sensitivity analysis is made possible by the development of a fully parameterized Finite Element model of the soundboard which allows the user to modify most geometric and material parameters involved in its dynamic behavior. In addition, crowning and downbearing are included in the model. This study also considers the influence of geometric nonlinearities due to downbearing. The sensitivity analysis is performed using Spearman rank correlation and Sobol indices.
UR - http://www.scopus.com/inward/record.url?scp=84897003651&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84897003651&partnerID=8YFLogxK
U2 - 10.1115/DETC2013-12676
DO - 10.1115/DETC2013-12676
M3 - Conference contribution
AN - SCOPUS:84897003651
SN - 9780791855997
T3 - Proceedings of the ASME Design Engineering Technical Conference
BT - 22nd Reliability, Stress Analysis, and Failure Prevention Conference; 25th Conference on Mechanical Vibration and Noise
PB - American Society of Mechanical Engineers
T2 - ASME 2013 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2013
Y2 - 4 August 2013 through 7 August 2013
ER -