A computer-aided design framework for modeling and simulation of VLSI interconnections and packaging

Pochang Hsu, Jerzy W. Rozenblit

Research output: Contribution to journalArticlepeer-review

1 Scopus citations


The higher speed requirement and rising complexity of interconnect and packaging structure in a VLSI system have increased the necessity of applying modeling and simulation techniques to develop CAD tools for analysis and design. To effectively manage design data and CAD tools involved for modeling and simulation of electronic packaging, a framework which provides different levels of services and abstractions is essential. This paper describes a computer-aided design framework which provides three levels of services for the aforementioned purpose. The first level of the framework supports CAD tool integrations and simulation management. A common graphical user interface is provided for the simulation environment. In the second level, design data representation and management are stressed. We applied an object-oriented approach to develop design libraries and encapsulate CAD tools. The third level of the framework emphasizes system level modeling and simulation for multiple chip systems. The underlying architecture and implementation of the framework are explained, design examples given.

Original languageEnglish (US)
Pages (from-to)163-187
Number of pages25
JournalIntegration, the VLSI Journal
Issue number2
StatePublished - Oct 1994


  • CAD framework
  • Electronic packaging
  • Simulation
  • Tool integration

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering


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