A broadband CPW-to-microstrip via-less transition for on wafer package probing applications

Lin Zhu; Kathleen L. Melde; John L. Prince

doi:10.1109/EPEP.2003.1250003

A broadband CPW-to-microstrip via-less transition for on wafer package probing applications

Lin Zhu, Kathleen L. Melde, John L. Prince

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Scopus citations

Abstract

A broadband CPW to microstrip via-less transition is proposed and the optimal design is discussed. Simulation and measurement results are given. The results of the transition as multiline TRL calibration standards are presented.

Original language	English (US)
Title of host publication	Electrical Performance of Electronic Packaging
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	75-78
Number of pages	4
ISBN (Electronic)	0780381289, 9780780381285
DOIs	https://doi.org/10.1109/EPEP.2003.1250003
State	Published - 2003
Event	Electrical Performance of Electronic Packaging, 2003 - Princeton, United States Duration: Oct 27 2003 → Oct 29 2003

Publication series

Name	Electrical Performance of Electronic Packaging

Other

Other	Electrical Performance of Electronic Packaging, 2003
Country/Territory	United States
City	Princeton
Period	10/27/03 → 10/29/03

ASJC Scopus subject areas

Electrical and Electronic Engineering
Hardware and Architecture

Access to Document

10.1109/EPEP.2003.1250003

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A broadband CPW-to-microstrip via-less transition for on wafer package probing applications. / Zhu, Lin; Melde, Kathleen L.; Prince, John L.
Electrical Performance of Electronic Packaging. Institute of Electrical and Electronics Engineers Inc., 2003. p. 75-78 1250003 (Electrical Performance of Electronic Packaging).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Zhu, L, Melde, KL & Prince, JL 2003, A broadband CPW-to-microstrip via-less transition for on wafer package probing applications. in Electrical Performance of Electronic Packaging., 1250003, Electrical Performance of Electronic Packaging, Institute of Electrical and Electronics Engineers Inc., pp. 75-78, Electrical Performance of Electronic Packaging, 2003, Princeton, United States, 10/27/03. https://doi.org/10.1109/EPEP.2003.1250003

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abstract = "A broadband CPW to microstrip via-less transition is proposed and the optimal design is discussed. Simulation and measurement results are given. The results of the transition as multiline TRL calibration standards are presented.",

author = "Lin Zhu and Melde, {Kathleen L.} and Prince, {John L.}",

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ER -

A broadband CPW-to-microstrip via-less transition for on wafer package probing applications

Abstract

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Other

ASJC Scopus subject areas

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