3D via modeling simplification on multilayer mid-planes

Qian Li; Kathleen L. Melde; Gong Jong Yeh; Hui Wu; Yaochao Yang

doi:10.1109/EPEPS.2011.6100228

3D via modeling simplification on multilayer mid-planes

Qian Li, Kathleen L. Melde, Gong Jong Yeh, Hui Wu, Yaochao Yang

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

Abstract

This paper presents a method to simplify the 3D full-wave simulation of via structures on the multilayer mid-planes. The method splits the full-length via model into small via sections, simulates these sections separately. The final simulation results are obtained by cascading the scattering parameters for the small via sections. The simulation accuracy of the cascaded structure for FEXT is comparable to the accuracy obtained with simulations of the 3D via using full-wave simulations in HFSS for frequencies up to 20GHz for both uniform structures and the structures with discontinuity. The results show a dramatic reduction in simulation time and complexity.

Original language	English (US)
Title of host publication	2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
Pages	207-210
Number of pages	4
DOIs	https://doi.org/10.1109/EPEPS.2011.6100228
State	Published - 2011
Event	2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011 - San Jose, CA, United States Duration: Oct 23 2011 → Oct 26 2011

Publication series

Name	2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011

Other

Other	2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
Country/Territory	United States
City	San Jose, CA
Period	10/23/11 → 10/26/11

Keywords

Cascade Method
Signal Integrity
Simplification
Via Modeling

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/EPEPS.2011.6100228

Cite this

Li, Q., Melde, K. L., Yeh, G. J., Wu, H., & Yang, Y. (2011). 3D via modeling simplification on multilayer mid-planes. In 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011 (pp. 207-210). Article 6100228 (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011). https://doi.org/10.1109/EPEPS.2011.6100228

3D via modeling simplification on multilayer mid-planes. / Li, Qian; Melde, Kathleen L.; Yeh, Gong Jong et al.
2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. 2011. p. 207-210 6100228 (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Li, Q, Melde, KL, Yeh, GJ, Wu, H & Yang, Y 2011, 3D via modeling simplification on multilayer mid-planes. in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011., 6100228, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011, pp. 207-210, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011, San Jose, CA, United States, 10/23/11. https://doi.org/10.1109/EPEPS.2011.6100228

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title = "3D via modeling simplification on multilayer mid-planes",

abstract = "This paper presents a method to simplify the 3D full-wave simulation of via structures on the multilayer mid-planes. The method splits the full-length via model into small via sections, simulates these sections separately. The final simulation results are obtained by cascading the scattering parameters for the small via sections. The simulation accuracy of the cascaded structure for FEXT is comparable to the accuracy obtained with simulations of the 3D via using full-wave simulations in HFSS for frequencies up to 20GHz for both uniform structures and the structures with discontinuity. The results show a dramatic reduction in simulation time and complexity.",

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N2 - This paper presents a method to simplify the 3D full-wave simulation of via structures on the multilayer mid-planes. The method splits the full-length via model into small via sections, simulates these sections separately. The final simulation results are obtained by cascading the scattering parameters for the small via sections. The simulation accuracy of the cascaded structure for FEXT is comparable to the accuracy obtained with simulations of the 3D via using full-wave simulations in HFSS for frequencies up to 20GHz for both uniform structures and the structures with discontinuity. The results show a dramatic reduction in simulation time and complexity.

AB - This paper presents a method to simplify the 3D full-wave simulation of via structures on the multilayer mid-planes. The method splits the full-length via model into small via sections, simulates these sections separately. The final simulation results are obtained by cascading the scattering parameters for the small via sections. The simulation accuracy of the cascaded structure for FEXT is comparable to the accuracy obtained with simulations of the 3D via using full-wave simulations in HFSS for frequencies up to 20GHz for both uniform structures and the structures with discontinuity. The results show a dramatic reduction in simulation time and complexity.

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3D via modeling simplification on multilayer mid-planes

Abstract

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Keywords

ASJC Scopus subject areas

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