TY - GEN
T1 - 3D printed multilayer microstrip line structure with vertical transition toward integrated systems
AU - Liang, Min
AU - Yu, Xiaoju
AU - Shemelya, Corey
AU - Macdonald, Eric
AU - Xin, Hao
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/7/24
Y1 - 2015/7/24
N2 - In this paper, a 3D printed multilayer microstrip line structure with vertical transition is designed, fabricated and characterized. The dielectric part of the structure is printed using the FDM method and the conductor part is printed using the ultrasonic wire embedding approach. The measured total insertion loss of the 3D printed multilayer microstrip (90 mm long) including the vertical transition is smaller than 2 dB below 6 GHz. The measured results agree well with the simulation. The performance of this structure demonstrates that 3D printing techniques may be able to realize functional multilayer RF components / systems. As an example, a 3D printed multilayer phased array is designed based on similiar microstrip and vertical transition structure in this work. The simulated results show good impedance matching around 3.5GHz and a high directive beam at expected direction.
AB - In this paper, a 3D printed multilayer microstrip line structure with vertical transition is designed, fabricated and characterized. The dielectric part of the structure is printed using the FDM method and the conductor part is printed using the ultrasonic wire embedding approach. The measured total insertion loss of the 3D printed multilayer microstrip (90 mm long) including the vertical transition is smaller than 2 dB below 6 GHz. The measured results agree well with the simulation. The performance of this structure demonstrates that 3D printing techniques may be able to realize functional multilayer RF components / systems. As an example, a 3D printed multilayer phased array is designed based on similiar microstrip and vertical transition structure in this work. The simulated results show good impedance matching around 3.5GHz and a high directive beam at expected direction.
KW - 3D printing
KW - Additive manufacturing
KW - multilayer microstrip line
KW - vertical transition
UR - http://www.scopus.com/inward/record.url?scp=84946098515&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84946098515&partnerID=8YFLogxK
U2 - 10.1109/MWSYM.2015.7167016
DO - 10.1109/MWSYM.2015.7167016
M3 - Conference contribution
AN - SCOPUS:84946098515
T3 - 2015 IEEE MTT-S International Microwave Symposium, IMS 2015
BT - 2015 IEEE MTT-S International Microwave Symposium, IMS 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - IEEE MTT-S International Microwave Symposium, IMS 2015
Y2 - 17 May 2015 through 22 May 2015
ER -