3D printable multilayer RF integrated system

Xiaoju Yu, Min Liang, Corey Shemelya, Ryan Wicker, Eric MacDonald, Hao Xin

Research output: Contribution to journalArticlepeer-review


In this work, a 3D-printable multilayer phased array system is designed to demonstrate the applicability of additive manufacturing technique combining dielectric and conductor processes at room temperature for RF systems. Phased array systems normally include feeding networks, antennas, and active components such as switches, phase shifters and amplifiers. To make the integrated system compact, the array system here uses multilayer structure that can fully utilize the 3D space. The vertical interconnections between layers are carefully designed to reduce the loss between layers. Simulated results show good impedance matching and highdirective scanning beam. This multilayer phased array will finally be 3D printed by integrating thermal / ultrasound wire mesh embedding method (for metal) and fused-deposition-modeling technique (for dielectric).

Original languageEnglish (US)
Pages (from-to)928-933
Number of pages6
JournalProceedings of the International Telemetering Conference
StatePublished - 2015


  • 3D print
  • Multi-layer
  • Phased array
  • Vertical interconnection

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation
  • Computer Networks and Communications
  • Signal Processing


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