3D Optical Interconnects for High-Speed Interchip and Interboard Communications

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@misc{2b28aac5a056427db73345e07e6f5152,

title = "3D Optical Interconnects for High-Speed Interchip and Interboard Communications",

author = "Hngki Sung and Ahmed Louri",

note = "Funding Information: This research was supported by NSF Grant No. MIP 9310082 and a grant from USWest.",

year = "1994",

month = oct,

doi = "10.1109/2.318581",

language = "English (US)",

volume = "27",

pages = "27--37",

journal = "Computer",

issn = "0018-9162",

publisher = "IEEE Computer Society",

}

TY - GEN

T1 - 3D Optical Interconnects for High-Speed Interchip and Interboard Communications

AU - Sung, Hngki

AU - Louri, Ahmed

N1 - Funding Information: This research was supported by NSF Grant No. MIP 9310082 and a grant from USWest.

PY - 1994/10

Y1 - 1994/10

UR - https://www.scopus.com/pages/publications/0028517832

UR - https://www.scopus.com/pages/publications/0028517832#tab=citedBy

U2 - 10.1109/2.318581

DO - 10.1109/2.318581

M3 - Article

AN - SCOPUS:0028517832

SN - 0018-9162

VL - 27

SP - 27

EP - 37

JO - Computer

JF - Computer

ER -