@article{ea38b221c85d46cbbd3bc6207fa63e9f,
title = "3-D Printed Parts for a Multilayer Phased Array Antenna System",
abstract = "In this work, a three-dimensional printable multilayer phased array system was designed to demonstrate the applicability of additive manufacturing for radio frequency (RF) systems. A hybrid process incorporating a thermal wire-mesh embedding method for conductors and thermoplastic material extrusion for dielectrics is employed. The designed phased array, operating at 3.5 GHz, consists of three functional layers: a 1-to-4 Wilkinson divider at the bottom, embedded voltage-controlled phase shifters at the center, and patch antennas on the top. Standalone parts of the proposed multilayer phased array were printed to verify the integrated dielectric-conductor printing process as well as the incorporation of active semiconductor devices at room temperature.",
keywords = "Multilayer, phased array, three-dimensional (3-D) printing",
author = "Xiaoju Yu and Min Liang and Corey Shemelya and Roberson, {David A.} and Ryan Wicker and Eric MacDonald and Hao Xin",
note = "Funding Information: Manuscript received July 19, 2018; revised September 9, 2018; accepted September 23, 2018. Date of publication October 1, 2018; date of current version October 26, 2018. This work was supported in part by the University of Arizona and the University of Texas at El Paso within the W. M. Keck Center for 3D Innovation (Keck Center); in part by the State of Texas Emerging Technology Fund; in part by the Keck Center recently expanded to over 13,000 sq. ft. housing state-of-the-art facilities and equipment for additive manufacturing processes, materials, and applications; in part by the National Science Foundation under Award 0925220 and 1408271; in part by the National Aeronautics and Space Administration under Grant NNX13AR17A; in part by the Intelligence Community Postdoctoral Research Fellowship Program under Grant 2012-12071000005; and in part by the state of Arizona under TRIF. (Corresponding author: Hao Xin.) X. Yu was with the University of Arizona, Tucson, AZ 85721 USA. He is now with the Qualcomm Technologies, Inc., San Diego, CA 92121 USA (e-mail:, daisy@email.arizona.edu). Publisher Copyright: {\textcopyright} 2002-2011 IEEE.",
year = "2018",
month = nov,
doi = "10.1109/LAWP.2018.2873116",
language = "English (US)",
volume = "17",
pages = "2150--2154",
journal = "IEEE Antennas and Wireless Propagation Letters",
issn = "1536-1225",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "11",
}